PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND METAL-SURFACE TREATMENT LIQUID

摘要

The purpose of the present invention is to provide a printed circuit board wherein a resin layer exhibits excellent adhesion and a method for manufacturing said printed circuit board. This printed circuit board is provided with an insulating substrate, metal wiring laid out on said insulating substrate, and an insulating layer disposed on top of said metal wiring. A layer consisting of a thiol compound having at least four functional groups represented by formula (1) is interposed between the metal wiring and the insulating layer at the interface therebetween.