<p>[Objective] To enable improvements in throughput in production of molds having deposited films as mold release layers. [Constitution] In production of a mold 1 having a deposited film on the surface thereof as a mold release layer (14), a quartz substrate (10) is plasma etched employing an etching gas that includes a sedimentary gas (5a)/(5b) to form a pattern of protrusions and recesses having a desired shape in a structure constituted by the quartz substrate (10) and a mask layer (M), while a deposited film constituted by sediment of the sedimentary gas (5a)/(5b) is formed along the pattern of protrusions and recesses.</p>
