发明名称 Soldering device for forming electrical solder connections in a disk drive unit
摘要 A soldering device for forming electrical solder connections in a disk drive unit comprises a nozzle device comprising at least two separated movable housings that provides a passage, the upper ends of the housings form an entrance, and the lower ends of the housings form a nozzle; and an actuating device connecting with the nozzle device and arranged for controlling the housings of the nozzle device to move together or apart, thereby controlling the inner diameter size of the nozzle. The present invention provides movable housings of the nozzle device so as to make the size of the nozzle controllable, finally benefits to perform a solder connection.
申请公布号 US2012248077(A1) 申请公布日期 2012.10.04
申请号 US201113067738 申请日期 2011.06.22
申请人 SAE MAGNETICS (H.K.) LTD. 发明人 HO YIUSING;CHEN CANHUA;LU GUOHONG;WANG BAOQUAN
分类号 B23K26/00 主分类号 B23K26/00
代理机构 代理人
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