OPTOELECTRONIC COMPONENT HAVING A TRANSPARENT COVER AND METHOD FOR PRODUCING THE SAME

摘要

An optoelectronic component (100) comprises a substrate (102) and a transparent cover (106) in which a cavity (108) is formed. A semiconductor (104) is mounted on the substrate (102). The transparent cover (106) covers at least the surface of the semiconductor chip (104) facing away from the substrate (102). The transparent cover (106) has a hardness greater than that of silicone.