Sn PLATING MATERIAL

摘要

[Problem] To provide a Sn plating material that can suppress occurrences of Sn powder by partially exposing a Cu-Sn alloy layer in a reflow Sn plating layer on the surface of a copper or copper alloy strip. [Solution] A Sn plating material (10) has a Sn plating layer (6) for which reflow processing has been carried out on the surface of a copper or copper alloy strip (2). The area ratio of a Cu-Sn alloy layer (4a) exposed on the outermost surface is 0.5 - 4%, and viewed from the outermost surface, the number of exposed spots for this Cu-Sn alloy layer is 100 - 900 per 0.033 mm2.