CHIP POSITION SPECIFICATION SYSTEM, CHIP POSITION SPECIFICATION DEVICE, CHIP POSITION SPECIFICATION PROGRAM, AND CHIP POSITION SPECIFICATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a chip position specification system which is suitable for specifying a position of an individual semiconductor integrated circuit chip on a semiconductor wafer before division.

SOLUTION: A chip position specification system 1 includes an appearance inspection device 10 which measures chip position specification information containing a first semiconductor chip position information in a semiconductor wafer and first appearance information containing coordinate information in the first semiconductor chip and image data of a characteristic portion in appearance of a pattern surface of a plurality of first semiconductor chips formed on the semiconductor wafer, and second appearance information containing coordinate information in a second semiconductor chip and the image data of an apparent characteristic portion of the pattern surface of the second semiconductor chip available after dividing the first semiconductor chip. It also includes a chip position specification device 20 which collates the first appearance information and the second appearance information each other, and based on the collation result, specifies a position on the semiconductor wafer before division into the second semiconductor chips.

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