发明名称 WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD AND WIRING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To obtain a long wiring material inexpensively by easing the restrictions due to a range being exposed by single exposure. <P>SOLUTION: In the individualization region of an insulating substrate 10, at least one slit 50 extending from one edge of the individualization region to the other edge side but not reaching the other edge, and an interconnection 31 forming a part of a wiring pattern 30p and is formed to surround the slit 50 are provided. When the individualized wiring material 2 is folded starting from a predetermined position of the slit 50, a part of the interconnection 31 formed on the insulating substrate 10 can be projected to the outside of the individualization region. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012190904(A) 申请公布日期 2012.10.04
申请号 JP20110051565 申请日期 2011.03.09
申请人 HITACHI CABLE LTD 发明人 ASHIZUKA NORIHIRO
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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