| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE |
| 摘要 |
The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
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| 申请公布号 |
US2012248632(A1) |
申请公布日期 |
2012.10.04 |
| 申请号 |
US201213410702 |
申请日期 |
2012.03.02 |
| 申请人 |
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发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI |
| 分类号 |
G03F7/004;B32B7/12;C09J7/00;H01L23/28 |
主分类号 |
G03F7/004 |
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