发明名称 LEAD STRUCTURES WITH VERTICAL OFFSETS
摘要 <p>A microelectronic structure includes a first row of contacts (14) and a second row of contacts (24) offset from the first row, so that the first and second rows cooperatively define pairs of contacts. These pairs of contacts include first pairs (30a) and second pairs (30b) arranged in alternating sequence in the row direction. The first pairs are provided with low connectors (32a), whereas the second pairs are provided with high connectors (32b). The high connectors and low connectors have sections vertically offset from one another to reduce mutual impedance between adjacent connectors.</p>
申请公布号 WO2012071325(A4) 申请公布日期 2012.10.04
申请号 WO2011US61647 申请日期 2011.11.21
申请人 TESSERA, INC.;CRISP, RICHARD DEWITT;HABA, BELGACEM;ZOHNI, WAEL 发明人 CRISP, RICHARD DEWITT;HABA, BELGACEM;ZOHNI, WAEL
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址