| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board which incorporates electronic components, is thin, and achieves high connection reliability. <P>SOLUTION: A cavity 75 is formed in a middle substrate 99 having a second insulation layer 60, a third insulation layer 70, a second conductor layer 68, and a third conductor layer 78. An IC chip 90 is incorporated in the cavity 75. Subsequently, a fourth insulation layer 80 and a fourth conductor layer 88 are formed. Hence, the manufacturing method allows the IC chip to be incorporated in a center part of a printed wiring board and reduces the amount of warpage of the printed wiring board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
