Semiconductor Device And Test Method For Semiconductor Device

摘要

A semiconductor device includes a first metal pattern formed on a first metal level. The first metal pattern has a U shaped first curved portion. A second metal pattern is formed on the first metal level. The second metal pattern has a U shaped second curved portion facing the first curved portion. A via structure is electrically connected to one of the first metal pattern and the second metal pattern. A third metal pattern is formed on a second metal level different from the first metal level and electrically connected to the via structure.