FLIP-CHIP LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
摘要
<p>A flip-chip light emitting diode and a manufacturing method thereof are provided. The flip-chip light emitting diode employs architecture of thin film chip and transparent substrate (30) based on substrate transfer technology, and a metal P-type electrode (22) is separately disposed in a non-light emitting region, thereby improving light extraction efficiency of the light emitting diode.</p>
申请公布号
WO2012130115(A1)
申请公布日期
2012.10.04
申请号
WO2012CN73024
申请日期
2012.03.26
申请人
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.;PAN, QUNFENG;WU, ZHIQIANG;LIN, KECHUANG
