SUBSTRATE CUTTING APPARATUS AND SUBSTRATE CUTTING METHOD USING THE SAME

摘要

PURPOSE: A substrate cutting device and a substrate cutting method using the same are provided to rapidly and stably cut unit substrates from a large-sized substrate. CONSTITUTION: A substrate cutting device(100) provides rotary tables(110) and pressing plates(130). A large-sized substrate(10) on which a plurality of cutting lines(11) is formed is settled on a spinning table. The rotary table has rotary shafts corresponding with the cutting lines. The pressing plate clinches the large-sized substrate on the rotary table. The spinning shaft comprises first rotary shafts(111) and second rotary shafts(112a,112b). The first rotary shaft rotates the rotary table in a V shape, and the second rotary shaft rotates the rotary table in a reversed V shape. A substrate cutting method comprises the following steps: forming a plurality of cutting lines to fit a unit substrate size on the large-sized substrate; fixing the large-sized substrate on the rotary table; and cutting a plurality of unit substrates along the cutting lines by spinning the rotary table around the plurality of rotary shafts.