Resin overcap provided with IC tag

摘要

The invention relates to a resin overcap (20) adapted to be fitted onto a cap (50) mounted on a container nozzle, comprising:
a top panel (21) and a cylindrical side wall (23) hanging down from a circumferential edge of the top panel (21) and in which said cap (50) fits;
wherein a step (25) or protrusions (30) are formed on an upper portion on an inner surface of said cylindrical side wall (23) to prevent an upward motion of the cap (50) fitted in said cylindrical side wall (23) and a knurling (27) is formed on the inner surface of said cylindrical side wall (23) at a position under said step (25) or said protrusions (30); and
an IC tag (10) provided with an IC chip (5) is mounted on said top panel (21) in a manner of maintaining a predetermined distance (D) to a top plate (51) of the cap (50) fitted into said cylindrical side wall (23), and
characterized in that,
the outer surface of the cylindrical side wall (23) of the overcap (20) is of a corrugated form in which concave surfaces and convex surfaces are alternately formed extending in the axial direction.