发明名称 |
SENSOR MODULE, PRODUCTION METHOD OF A SENSOR MODULE, AND INJECTION MOLD FOR ENCAPSULATING A SENSOR MODULE |
摘要 |
A sensor module an injection mold for covering the sensor module, and to a production method for a covered sensor module including a chip carrier and a sensor chip disposed thereon. A channel is formed between the chip carrier and the sensor chip, by which a medium can be fed to the sensor chip. |
申请公布号 |
EP2504668(A2) |
申请公布日期 |
2012.10.03 |
申请号 |
EP20100790367 |
申请日期 |
2010.11.26 |
申请人 |
CONTINENTAL AUTOMOTIVE GMBH |
发明人 |
REITMEIER, WILLIBALD;WILDGEN, ANDREAS |
分类号 |
G01D11/24 |
主分类号 |
G01D11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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