Method to form solder deposits and non-melting bump structures on substrates

摘要

Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate (102) including a permanent resin layer (103) on top of at least one contact area (101) and a temporary resin layer (104) on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer (106) on the substrate surface and iii) electroplate a metal or metal alloy layer (107) onto the conductive layer.