| 摘要 |
A semiconductor device is provided whereby the signal interference among a plurality of function blocks is reduced. In a semiconductor device having a CSP structure, an integrated circuit containing a plurality of function blocks is formed on a semiconductor substrate. A plurality of external electrodes are classified into a plurality of groups of external electrodes according to function blocks connected, and are arranged in a plurality of divided regions for each of the plurality of groups of external electrodes. Rewirings connected to external electrodes of low impedance are placed in a boundary area between the plurality of regions. |
