发明名称 |
Method for manufacturing printed circuit board |
摘要 |
The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed. |
申请公布号 |
US8276270(B2) |
申请公布日期 |
2012.10.02 |
申请号 |
US20080666634 |
申请日期 |
2008.04.22 |
申请人 |
HOTTA TERUYUKI;MORIMOTO SHUSHI;ISHIZAKI TAKAHIRO;YAMAMOTO HISAMITSU;C. UYEMURA & CO., LTD. |
发明人 |
HOTTA TERUYUKI;MORIMOTO SHUSHI;ISHIZAKI TAKAHIRO;YAMAMOTO HISAMITSU |
分类号 |
H01K3/10 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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