| 发明名称 |
Method for packaging semiconductor device |
| 摘要 |
The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased.
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| 申请公布号 |
US8278145(B2) |
申请公布日期 |
2012.10.02 |
| 申请号 |
US201113064646 |
申请日期 |
2011.04.06 |
| 申请人 |
CHEN CHIEN-WEN;ZU LONGQIANG;TSAI CHEN-FA;GLOBAL UNICHIP CORPORATION |
发明人 |
CHEN CHIEN-WEN;ZU LONGQIANG;TSAI CHEN-FA |
| 分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
| 代理机构 |
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