发明名称 Methods of forming a semiconductor device having a contact structure
摘要 A method of forming a semiconductor device having a contact structure includes forming an insulating layer on a semiconductor substrate, and selectively implanting impurity ions into a predetermined region of the insulating layer to generate lattice defects in the predetermined region of the insulating layer. A thermal treatment, such as quenching the insulating layer at a temperature change rate of at least −20° C./minute, is performed on the insulating layer having the lattice defects to accelerate generation of the lattice defects in the predetermined region such that a conductive region results from the generated lattice defects to provide current paths in the predetermined region.
申请公布号 US8278180(B2) 申请公布日期 2012.10.02
申请号 US20100871273 申请日期 2010.08.30
申请人 LEE CHANGHUN;CHUN KEEMOON;SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE CHANGHUN;CHUN KEEMOON
分类号 H01L21/331;H01L21/302;H01L21/461 主分类号 H01L21/331
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