发明名称 Material pattern, and mold, metal thin-film pattern, metal pattern using thereof, and methods of forming the same
摘要 The present invention relates to a material pattern, and mold using thereof, metal thin-film pattern, metal pattern, and method of forming the sames. A method of forming the material pattern according to the present invention comprises the steps of; (a) forming a photo-sensitive material film by coating a photo-sensitive material on a substrate; (b) deciding an exposure section on the photo-sensitive material film; (c) disposing a light refraction film and a light diffusion film at a route of light exposed on the photo-sensitive material film; and (d) forming a pattern on the photo-sensitive material film, by projecting a light on the exposure section of the photo-sensitive material film, wherein the light transmits the light refraction film and the light diffusion film. A method of forming the material pattern according to the present invention can form the material pattern of three-dimensional asymmetric structure having various inclinations and shapes and can form simply mold, metal thin-film and metal pattern using thereof.
申请公布号 US8278028(B2) 申请公布日期 2012.10.02
申请号 US20080098180 申请日期 2008.04.04
申请人 JEON JIN-WAN;YOON JUN-BO;LIM KOENG SU;KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 JEON JIN-WAN;YOON JUN-BO;LIM KOENG SU
分类号 G03F7/20;G03F1/76;H01L21/027 主分类号 G03F7/20
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