发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
Disclosed is a semiconductor device comprising: a semiconductor substrate in which an integrated circuit is formed; a first resin film provided over the semiconductor substrate; a second resin film provided over an upper surface of the first resin film except at least a peripheral portion of the first resin film; and a thin film inductor provided over the second resin film.
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申请公布号 |
US8278734(B2) |
申请公布日期 |
2012.10.02 |
申请号 |
US20100729558 |
申请日期 |
2010.03.23 |
申请人 |
MIHARA ICHIRO;TERAMIKROS, INC. |
发明人 |
MIHARA ICHIRO |
分类号 |
H01L27/08 |
主分类号 |
H01L27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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