| 摘要 |
Embodiments of the present invention are directed to methods and systems for laser micro-machining, which may include dividing a long line illumination field into a plurality of individual fields, wherein each of the plurality of fields includes an aspect ratio of about 4:1 or greater, directing the plurality of individual fields onto at least one mask, wherein each individual field illuminates a corresponding area on the mask and translating the mask and/or workpiece relative to one another along a scan axis. |
