发明名称 |
Circuit substrate and circuit substrate manufacturing method |
摘要 |
A circuit substrate includes protruding terminals and has a structure that ensures an excellent connection with an electronic component, such as an IC. The circuit substrate on which an IC is to be mounted includes terminals that are to be electrically connected to solder bumps located on the IC. The terminals protrude from the mounting surface of a substrate body on which the IC is to be mounted. The sectional area of the top surface of each of the terminals is about 1.2 times the sectional area of each of the terminals on the mounting surface. |
申请公布号 |
US8279618(B2) |
申请公布日期 |
2012.10.02 |
申请号 |
US20100717170 |
申请日期 |
2010.03.04 |
申请人 |
FUKUDA YUTAKA;MURATA MANUFACTURING CO., LTD. |
发明人 |
FUKUDA YUTAKA |
分类号 |
H05K7/10;H05K1/16;H05K7/00 |
主分类号 |
H05K7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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