| 摘要 |
PURPOSE: A substrate for manufacturing a semiconductor package, a manufacturing method thereof, and the semiconductor package using the same are provided to easily manufacture a substrate of one layer structure with small input and output terminals by embedding a conductive pattern in a prepreg base. CONSTITUTION: A substrate for manufacturing a semiconductor package is comprised of a base(10) and a conductive pattern(12). The conductive pattern is embedded in a prepreg base with a preset circuit arrangement. The upper side of the conductive pattern is exposed as a wire bonding surface through the upper side of the prepreg base. The lower side of the conductive pattern is exposed as a ball land through a groove formed on the lower side of the prepreg base. An anti-oxidation metal layer(20) is coated on the upper side and the lower side of the conductive pattern. |
