| 摘要 |
PURPOSE: A semiconductor device is provided to buffer stress according to a warpage phenomenon by supporting an input/output terminal such as a solder ball or a bump attached on the outer side of a semiconductor chip using a support member. CONSTITUTION: A semiconductor chip(10) comprises an electrode pad(14). The electrode pad is arranged on the whole area of the semiconductor chip with an equal distance from each other. A bump or a solder ball(40) is attached on the electrode pad. A support member(60) arranges a passivation material(62) for reducing stress on an uppermost second passivation film(20). The support member supports the bump or the solder ball on the surface of the semiconductor chip. |
