发明名称 Light-emitting diode assembly
摘要 The assembly has a light-emitting chip (1) with a radiation decoupling surface (2), via which the greater part of the electromagnetic radiation that is generated in the chip emerges in a primary emission direction. The chip is placed on a heat sink (4). A housing (5) laterally surrounds the chip and a reflective lens (6) is situated downstream of the surface (2) in the primary emission direction. An independent claim is also included for a utilization of the light emitting assembly in equipment such as camera mobile phone, digital camera or video camera.
申请公布号 KR101187090(B1) 申请公布日期 2012.09.28
申请号 KR20077002118 申请日期 2005.05.18
申请人 发明人
分类号 H01L33/48;H01L33/58;H01L33/60 主分类号 H01L33/48
代理机构 代理人
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