发明名称 |
CIRCUIT BOARD, MANUFACTURING METHOD OF CIRCUIT BOARD, SUSPENSION SUBSTRATE, SUSPENSION, DEVICE-MOUNTED SUSPENSION, AND HARD DISK DRIVE |
摘要 |
The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.
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申请公布号 |
US2012241200(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201013511793 |
申请日期 |
2010.12.24 |
申请人 |
CHIYONAGA JUNICHI;TAKATSU HIROMICHI;MIURA YOICHI;NAGAI YOICHI;DAI NIPPON PRINTING CO., LTD. |
发明人 |
CHIYONAGA JUNICHI;TAKATSU HIROMICHI;MIURA YOICHI;NAGAI YOICHI |
分类号 |
H05K1/05;H05K3/22 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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