发明名称 Miniature Wafer-Level Camera Modules
摘要 In one aspect, a method includes providing a lens substrate having an array of lenses. The lens substrate includes an overflow region next to each lens of the array. Each overflow region includes an overflow lens material. The method also includes separating the lens substrate into a plurality of smaller lens substrates. Each of the smaller lens substrates has one of the single lens and the plurality of stacked lenses. Separating the lens substrate into the smaller lens substrates may include removing or substantially removing the overflow regions. In one aspect, the method may be performed as a method of making a miniature camera module. Other methods are also described, as are miniature camera modules.
申请公布号 US2012242814(A1) 申请公布日期 2012.09.27
申请号 US201113071892 申请日期 2011.03.25
申请人 KUBALA KENNETH;SILVEIRA PAULO E. X.;TACHIHARA SATORU 发明人 KUBALA KENNETH;SILVEIRA PAULO E. X.;TACHIHARA SATORU
分类号 H04N5/225;B26D3/00;B32B38/04;H04N7/18 主分类号 H04N5/225
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