发明名称 |
BUILD-UP PRINTED WIRING BOARD SUBSTRATE HAVING A CORE LAYER THAT IS PART OF A CIRCUIT |
摘要 |
Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole. |
申请公布号 |
US2012241202(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201213491388 |
申请日期 |
2012.06.07 |
申请人 |
VASOYA KALU K.;STABLCOR TECHNOLOGY, INC. |
发明人 |
VASOYA KALU K. |
分类号 |
H05K1/11;H05K1/03;H05K1/09 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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