| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology advantageous for removing foreign matters existing on the substrate holding surface or the mold holding surface in an imprint apparatus. <P>SOLUTION: The imprint apparatus 100 which cures a resin applied to a substrate by bringing the pattern surface of a mold into contact with the resin comprises: a substrate holding part 4 which holds the substrate; a mold holding part 3 which holds the mold by the mold holding surface MS; a drive mechanism for moving the substrate holding part 4 relatively to the mold holding part 3; and a cleaning control unit 20 which controls the drive mechanism so that the substrate holding part 4 moves relatively to the mold holding part 3, in a state where a cleaning member 12 is held by the substrate holding part 4 in place of the substrate and the cleaning member 12 is brought into contact with the mold holding surface MS, thus cleaning the mold holding surface MS. <P>COPYRIGHT: (C)2012,JPO&INPIT |
