发明名称 LIQUID LEAD PIPE MOUNTING STRUCTURE, AND LIQUID EJECTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a liquid lead pipe mounting structure to recover the liquid leaked from a liquid container when pulling out the liquid lead pipe that leads the liquid from the liquid container, and to provide a liquid ejecting apparatus that includes the liquid lead pipe mounting structure. <P>SOLUTION: A first ink absorber is received in a slider 40 and its abutment surface 51a is arranged to project from the slider 40. Then an insertion slot of a cartridge 18 is covered with the first ink absorber by making the abutment surface 51a abut to an insertion surface 19b of a cartridge 18, while the cartridge 18 is mounted on the slider 40. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012183839(A) 申请公布日期 2012.09.27
申请号 JP20120152200 申请日期 2012.07.06
申请人 SEIKO EPSON CORP 发明人 ITO HIROYUKI;YOSHIDA ATSUSHI;KUMAGAI TOSHIO;YOSHINO KEIICHIRO
分类号 B41J2/175 主分类号 B41J2/175
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