| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method, which detect ink adhesion even when a front face and a rear face of a semiconductor wafer are not electrically connected. <P>SOLUTION: A conductive ink 2 is adhered to a specific location on a semiconductor wafer 7 by an inker 1 having a conductive inner core 5. A terminal 6 is caused to perform probing on a pad 8 on the semiconductor wafer 7. A current flowing between the inner core 5 and the terminal 6 is measured by a measuring instrument 9. In the case where a current flowing between the inner core 5 and the terminal 6 via the conductive ink 2 can be measured by the measurement instrument 9, it is determined that the conductive ink 2 properly adheres to the semiconductor wafer 7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
