| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive connection structure of a first wiring board mounting at least one chip component on one substrate surface and a second wiring board, in which the mounting surface can be narrowed, excellent conductive connection is possible even if the height of the chip components varies, high temperature heating at 200°C or higher is not required during conductive connection, sufficient conductive connection strength is ensured, and high degree of freedom is ensured in wiring connection design. <P>SOLUTION: In a conductive connection structure 1, an external electrode 11E exposed to the upper end of a chip component 11 on a first wiring board 10 and a terminal of a second wiring board 30 are connected conductively via an anisotropic conductive adhesive mounted on the external electrode 11E. <P>COPYRIGHT: (C)2012,JPO&INPIT |
