| 摘要 |
[Problem] To provide a resin composition that is suitable for use in printed circuit boards and that maintains flame resistance, has excellent electrical properties, heat resistance, and peel strength, and to provide a prepreg and resin sheet that use the same, and a metal foil-clad laminate that uses the prepreg. [Solution] A resin composition obtained from a polyphenylene ether (A), a specific phosphorus-containing cyanic acid ester compound (B), a halogen-free epoxy resin (C), a cyanic acid ester compound (D), and a filler (E). |
