ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component in which a sealing resin formed so as to cover an electronic component element is prevented from being charged, and to provide an electronic component manufacture by the method.

SOLUTION: A manufacturing method of an electronic component comprises: a step of mounting a surface acoustic wave element 20 on a mounting substrate 10; a step of forming a sealing resin 40 so as to cover the surface acoustic wave element 20 mounted on the mounting substrate 10; and a step of performing a plasma treatment on a surface of the sealing resin 40.

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