发明名称 |
SEMICONDUCTOR PACKAGING PROCESS USING THROUGH SILICON VIAS |
摘要 |
A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.
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申请公布号 |
US2012241976(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201213488930 |
申请日期 |
2012.06.05 |
申请人 |
DIGITALOPTICS CORPORATION EUROPE LIMITED |
发明人 |
HABA BELGACEM;HUMPSTON GILES;MARGALIT MOTI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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