发明名称 |
METHOD AND APPARATUS FOR CUTTING A SUBSTRATE |
摘要 |
A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates includes a rotating table and a push plate. The rotating table, on which the large size substrate having formed thereon a plurality of cutting lines is mountable, includes rotating shafts at locations corresponding to the cutting lines. The push plate fixes a position of the large size substrate on the rotating table. |
申请公布号 |
US2012241488(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201213370572 |
申请日期 |
2012.02.10 |
申请人 |
KANG JI-HYEON;LEE HYUN-CHUL;LIM WON-KYU |
发明人 |
KANG JI-HYEON;LEE HYUN-CHUL;LIM WON-KYU |
分类号 |
B26F3/00;C03B33/033 |
主分类号 |
B26F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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