发明名称 |
RESIST PATTERN FORMATION METHOD |
摘要 |
A resist pattern formation method includes providing a first positive-tone radiation-sensitive resin composition on a substrate to form a first resist layer. The first resist layer is selectively exposed and developed to form a first resist pattern. The first resist pattern is coated with a resist pattern insolubilizing resin composition which comprises a resin and an alcohol solvent, the resin having a hydroxyl group. The resist pattern insolubilizing resin composition is baked or cured with UV to insolubilize the first resist pattern in a developer and in a second positive-tone radiation-sensitive resin composition. The resist pattern insolubilizing resin composition is developed to form an insolubilized resist pattern. The second positive-tone radiation-sensitive resin composition is provided on the insolubilized resist pattern to form a second resist layer. The second resist layer is selectively exposed and developed to form a second resist pattern. |
申请公布号 |
US2012244478(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201213489683 |
申请日期 |
2012.06.06 |
申请人 |
NAKAMURA ATSUSHI;NAGAI TOMOKI;ABE TAKAYOSHI;KAKIZAWA TOMOHIRO;JSR CORPORATION |
发明人 |
NAKAMURA ATSUSHI;NAGAI TOMOKI;ABE TAKAYOSHI;KAKIZAWA TOMOHIRO |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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