发明名称 RESIST PATTERN FORMATION METHOD
摘要 A resist pattern formation method includes providing a first positive-tone radiation-sensitive resin composition on a substrate to form a first resist layer. The first resist layer is selectively exposed and developed to form a first resist pattern. The first resist pattern is coated with a resist pattern insolubilizing resin composition which comprises a resin and an alcohol solvent, the resin having a hydroxyl group. The resist pattern insolubilizing resin composition is baked or cured with UV to insolubilize the first resist pattern in a developer and in a second positive-tone radiation-sensitive resin composition. The resist pattern insolubilizing resin composition is developed to form an insolubilized resist pattern. The second positive-tone radiation-sensitive resin composition is provided on the insolubilized resist pattern to form a second resist layer. The second resist layer is selectively exposed and developed to form a second resist pattern.
申请公布号 US2012244478(A1) 申请公布日期 2012.09.27
申请号 US201213489683 申请日期 2012.06.06
申请人 NAKAMURA ATSUSHI;NAGAI TOMOKI;ABE TAKAYOSHI;KAKIZAWA TOMOHIRO;JSR CORPORATION 发明人 NAKAMURA ATSUSHI;NAGAI TOMOKI;ABE TAKAYOSHI;KAKIZAWA TOMOHIRO
分类号 G03F7/20 主分类号 G03F7/20
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