| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a via connection reliability for connecting circuit boards in a component built-in substrate in which insulating resin layers sandwich a plurality of circuit boards. <P>SOLUTION: The component built-in substrate comprises an insulating layer 101; multilayer wiring board 151, 152 which is arranged on front and rear faces of the insulating layer and in which a wiring pattern 103 is formed on a board surface contacting with the insulating layer and a solder resist 106 is formed on a part of the wiring pattern; and a via 102 formed in the insulating layer and filled with a conductive paste. The solder resist is not formed on a contact part contacting with the conductive paste in the wiring pattern, and there is partially a notch 105 on the contact part and the periphery part where the solder resist is formed. The insulating layer is formed on the notch thereby the insulating layer is adhered to the board surface of the multilayer wiring board, and the ratio of the area of the notch to the area where the solder resist is not formed thereon, is equal to or more than 30%, and is equal to or less than 70%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
