发明名称 |
EPOXY RESIN COMPOSITION, PROCESS FOR PRODUCTION OF ASSEMBLY USING SAME, AND ASSEMBLY |
摘要 |
<p>An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).</p> |
申请公布号 |
KR20120106995(A) |
申请公布日期 |
2012.09.27 |
申请号 |
KR20127019638 |
申请日期 |
2010.12.20 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
KOYAMA TAICHI;MORIYAMA HIRONOBU;MATSUMURA TAKASHI;SAITO TAKAYUKI |
分类号 |
C08G59/40;C08L63/00;H01L21/60;H05K3/32 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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