发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can achieve high performance and high reliability by an inexpensive process, and to provide a method of manufacturing the same. <P>SOLUTION: A semiconductor device comprises a first transistor and a second transistor. The first transistor includes: a first impurity layer of a first conductivity type formed in a first region; a first epitaxial semiconductor layer formed on the first impurity layer; a first gate electrode formed on the first epitaxial semiconductor layer via a first gate insulating film; and a first source/drain region formed in the first region. The second transistor includes: a second impurity layer of a second conductivity type formed in a second region; a second epitaxial semiconductor layer that is formed on the second impurity layer and has a different thickness from the first epitaxial semiconductor layer; a second gate electrode formed on the second epitaxial semiconductor layer via a second gate insulating film having the same film thickness as the first gate insulating film; and a second source/drain region formed in the second region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012186281(A) |
申请公布日期 |
2012.09.27 |
申请号 |
JP20110047764 |
申请日期 |
2011.03.04 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
FUJITA KAZUJI;EMA TAIJI;OGAWA HIROYUKI |
分类号 |
H01L21/8238;H01L21/336;H01L21/8234;H01L27/088;H01L27/092;H01L29/78 |
主分类号 |
H01L21/8238 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|