| 摘要 |
A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.
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