发明名称 |
ELECTROLYTIC COPPER FOIL FOR ELECTROMAGNETIC-WAVE SHIELDING, AND MANUFACTURING METHOD THEREFOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrolytic copper foil which is suited to an electromagnetic-wave shielding conductive film used for the front panel of a plasma display panel (PDP) and has a surface treatment layer suitable for blackening treatment to be conducted thereafter. <P>SOLUTION: The electrolytic copper foil for electromagnetic-wave shielding has a treatment surface, wherein zinc deposition on copper foil S surface is 30-110 μg/dm<SP POS="POST">2</SP>, chrome deposition on copper foil M surface is 25-50 μg/dm<SP POS="POST">2</SP>and a ratio Cr(s)/Cr(m) of the chrome deposition (Cr(s)) on copper foil S surface to the chrome deposition (Cr(m)) on copper foil M surface is 0.5 to 1.8. In a method for producing the electrolytic copper foil for electromagnetic-wave shielding, a plating bath 2 for forming a barrier layer made mainly of zinc and a plating bath 3 for forming a rust preventive layer made mainly of chrome are used to form a zinc layer by electroplating and a chrome layer by electroplating or immersion chromate method on the copper foil S surface, and to form a zinc layer by electroplating and a chrome layer by electroplating or immersion chromate method on the copper foil M surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012184498(A) |
申请公布日期 |
2012.09.27 |
申请号 |
JP20110284625 |
申请日期 |
2011.12.27 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
ISHII MASASHI;KOBAYASHI YOSUKE;MINAGAWA YOICHI |
分类号 |
C23C28/00;C23C22/24;C25D7/06;C25D11/38;H05K9/00 |
主分类号 |
C23C28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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