| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a DAF fracture in an outer periphery of a wafer by selectively cooling only a wafer division target region. <P>SOLUTION: A workpiece dividing device for dividing a workpiece attached to a dicing tape via a die-attach film into individual chips along a parting schedule line formed in advance comprises: selective cooling means capable of selectively cooling only a division target region of the workpiece of the die-attach film based on a heat transfer phenomenon by getting contact with the dicing tape from a side opposite to the die-attach film attached to a surface of the dicing tape, the workpiece attached onto the die-attach film, and a side on which the die-attach film of the dicing tape was attached; and workpiece division means for dividing the workpiece together with the die-attach film selectively cooled by expanding the dicing tape along the parting schedule line. <P>COPYRIGHT: (C)2012,JPO&INPIT |
