MANUFACTURING METHOD FOR ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE

摘要

Provided is a manufacturing method for an electronic component module in which collapse of hollow spaces is suppressed. The method is characterized in being provided with: a step for preparing an electronic component (10a) which has an element substrate (12), a drive portion (16a) formed upon one main surface of the element substrate (12), and a protector portion (18) covering the drive portion (16a) so as to form a hollow space (14) around the drive portion (16a); a step for fixing the electronic component (10a) upon a common substrate (46) so that one main surface of the common substrate (46) and another main surface of the element substrate (12) are opposed; a step for fixing a reinforcing plate (28) upon the protector portion (18) of the electronic component (10a); and a step for forming a resin layer (48) upon the one main surface of the common substrate (46) so as to embed the electronic component (10a).