发明名称 INJECTION MOLDING DEVICE AND METHOD FOR DISCHARGING HEAT MEDIUM FOR INJECTION MOLDING DEVICE
摘要 The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.
申请公布号 US2012241125(A1) 申请公布日期 2012.09.27
申请号 US201013512812 申请日期 2010.04.21
申请人 HATTORI MICHITAKA;IMAEDA SATOSHI;KARIYA TOSHIHIKO;MITSUBISHI HEAVY INDUSTRIES PLASTIC TECHNOLOGY CO., LTD. 发明人 HATTORI MICHITAKA;IMAEDA SATOSHI;KARIYA TOSHIHIKO
分类号 F28F27/00;B29C45/73;F28F27/02 主分类号 F28F27/00
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