| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing/die-bonding film excellent in heat resistance, adhesiveness and moisture absorption property and having excellent thermal conductivity and electric insulation properties even in a reflow process or under a condition of high-temperature and humidity, and to provide a semiconductor device manufactured by using the dicing/die-bonding film. <P>SOLUTION: A dicing/die-bonding film is provided with a thermosetting die-bonding film on a dicing film, in which adhesive composition composing the thermosetting die-bonding film includes an acrylate resin, a phenolic resin and thermal conductive particles. Assuming that, with respect to a total volume of the adhesive composition, a total content of the acrylate resin and the phenolic resin is A wt.% and a content of the thermal conductive particles is B wt.%, a value obtained from a formula (B/(A+B)) is within a range from 0.50 or more to 0.93 or less. Tensile storage elastic modulus of the thermosetting die-bonding film at 200°C after setting at 175°C for one hour is 0.1 MPa and over. <P>COPYRIGHT: (C)2012,JPO&INPIT |
