| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board which can suppress elution of copper ions and thus can prevent the occurrence of electrochemical migration. <P>SOLUTION: The printed wiring board comprises a core substrate and a copper foil layer. In a resin used for the core substrate, an inorganic filler having a particle diameter of 1-300 nm is dispersed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
