| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a production method of a wiring board including a step for smoothing the surface of a substrate before being coated with underfill, in order to enhance wetting and spreading properties of underfill, while opening a resist under an electronic component mounted on the wiring board, and to provide a wiring board produced by the production method. <P>SOLUTION: A de-smearing step (S21) is performed after a pattern etching step (S5). Since the de-smearing step is performed following the pattern etching step for exposing a substrate, the surface of the substrate can be smoothed by imparting a chemical to the surface of the substrate where multiple protrusions and recesses are formed by copper foil subjected to anchoring. Alternatively, a buff polishing or jet scrubbing step (S22) may be performed before a resist coating step (S7), or a buff polishing or jet scrubbing step (S23) may be performed between a soft etching step (S9) and a gold plating step (S10). <P>COPYRIGHT: (C)2012,JPO&INPIT |
